HUITIAN HT1101G (0112G) is an organic silicon heat conductive material, which is composed of the conductive and insulating metal oxides and polyorganosiloxane.There is no corrosion of the components.
It is excellent for heat resistance, moisture resistance and cold resistance, and can prolong the service life of accessories.
It has excellent thermal conductivity, insulation, moisture-proof, electric halo, anti-leakage and chemical resistance.
Product features
With excellent thermal conductivity, the heat conduction coefficient is greater than 1.50 W/m K.
2. The use of wide temperature, working temperature to 50 ~ 250 ℃.
It is not oily, non-toxic, odorless and environmentally friendly.
The touch variant is suitable for manual operation.
Application scenarios
Irreversible HT1101G (0112 g) thermal conductive silicone is widely used as heat transfer media of electronic components, such as CPU and radiator filler, power transistor, thyristor tube in contact with the substrate (aluminum, copper) gaps filling, reduce the working temperature of the heating element.
The performance parameters
Method of use
Clean surface: it is cleaned by the surface of the sticky material, ensuring that the surface of sticky or coated surfaces is clean, no oil, no dust, etc.
Glue: squeeze the gel onto the cleaned surface and distribute it evenly. It will be glued together
Solidification: the process of solidifying in the air with a glued or sealed component will be solidified by the surface.
After the operation is completed, the adhesive should be tightened and sealed immediately.Professional adhesive technology solution please click for consultation
HUITIAN HT1101G (0112G) for the purchase of links:
